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0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer

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    Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers
     
    Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers
    • Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers
    • Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers
    • Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers
    • Buy cheap 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer from wholesalers

    0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer

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    Brand Name : EastStar
    Model Number : ES-WFR-Dura420
    Price : negotiable
    Payment Terms : T/T,Western Union,MoneyGram,D/P,D/A
    Delivery Time : 10days after getting advance payment
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    0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer

    Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420


    1. Introduction of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420


    Wafer frame ring ES-WFR-Dura420 is made of German Dura420 high hardness stainless steel plate, which can ensure the right performance as wafer metal ring. It is also known or named as wafer frame, wafer mounting ring, wafer loading ring, wafer dicing ring, wafer metal ring, wafer ring frame or wafer frame ring.


    Wafer frame ringES-WFR-Dura420 can provide safe support during the process of wafer or chip shipping and handling operations. Such wafer dicing ring is featuring extremely light weight and reliable shaping performance. We have many end users of wafer or chip producers globally around the world.


    Material

    German Dura420stainless steel

    Wafer frame ring thickness and sizes:


    1) 06 inches

    (External diameter Φ228mm/ inner diameterΦ194mm/ Thickness 1.2mm

    2) 08 inches

    (External diameter Φ276mm / inner diameterΦ250mm/ Thickness 1.2mm

    3) 12 inches

    (External diameter Φ400mm / inner diameterΦ350mm/ Thickness 1.5mm

    Surface treatment

    Mechanical Polishing/ glossy surface Ra<0.15um/matte surface Ra>0.3um/mirror surface Ra<0.05um

    Surface Hardness:

    HRC48-55

    Size tolerance

    ±0.5mm.

    Angle tolerance

    0° 30″.

    Flatness level

    <0.2mm

    Ring shape

    Inner circular shape, Inner square shape and special customized shapes. All the shapes and sizes can be customized as per the user drawing.


    2. Technical parameter of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420


    Technical parameters for EASTAR® wafer frame ring:


    1). Material: German Dura420stainless steel

    2). Wafer frame ring thickness and sizes:

    1) 06 inches

    (External diameter Φ228mm/ inner diameterΦ194mm/ Thickness 1.2mm
    2) 08 inches

    (External diameter Φ276mm / inner diameterΦ250mm/ Thickness 1.2mm
    3) 12 inches

    (External diameter Φ400mm / inner diameterΦ350mm/ Thickness 1.5mm

    3). Surface treatment: Mechanical Polishing/ glossy surface Ra<0.15um/matte surface Ra>0.3um/mirror surface Ra<0.05um

    4). Surface Hardness: HRC48-55

    5). Size tolerance: +/-0.5mm

    6). Angle tolerance: 0° 30″.

    7). Flatness level: <0.2mm


    Ring shape: Inner circular shape, Inner square shape and special customized shapes. All the shapes and sizes can be customized as per the user drawing.


    3. Application of Mechanical Polishing Glossy Ra<0.15um Hardness HRC48-55 Wafer Dicing Frame Ring ES-WFR-Dura420


    EASTAR® Wafer frame ringES-WFR-Dura420 (also named as Wafer Dicing Ring/Wafer Metal Frame/Wafer Metal Ring/Wafer Ring Frame/Wafer Frame Ring) is working as a circular or special shape metal ring used to protect the edges of wafers and chips, mainly used in the laser marking process of wafers to provide protection and position limit. The wafer frame ring can withstand the high temperature and energy during the UV laser marking process to prevent chip damage and edge fragmentation.




    Quality 0.5mm Tolerance Hardness 1.5mm Wafer Dicing Frame Ring Frame Wafer for sale
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